Smith,
I don't see why not; the other item we need to review are the slides for the F2F...
(I'll be posting them today or tomorrow...)
> On Apr 19, 2018, at 3:43 PM, Kennedy, Smith (Wireless & Standards Architec) <smith.kennedy at hp.com> wrote:
>> Hi Mike and Ira,
>> Can we prioritize reviewing this draft in next week's IPP WG meeting? I think there are some partners that would very much like to contribute to its development and learn more about it.
>> Smith
>> /**
> Smith Kennedy
> Wireless & Standards Architect - IPG-PPS
> Standards - IEEE ISTO PWG / Bluetooth SIG / Wi-Fi Alliance / NFC Forum / USB-IF
> Chair, IEEE ISTO Printer Working Group
> HP Inc.
> */
>>>>> On Apr 16, 2018, at 12:33 PM, Michael Sweet <msweet at apple.com> wrote:
>>>> All,
>>>> I have posted an updated interim draft of the "Safe G-Code Subset for 3D Printing" white paper to:
>>>>https://ftp.pwg.org/pub/pwg/ipp/wd/wd-sweet-safe-gcode-20180416.docx>>https://ftp.pwg.org/pub/pwg/ipp/wd/wd-sweet-safe-gcode-20180416.pdf>>https://ftp.pwg.org/pub/pwg/ipp/wd/wd-sweet-safe-gcode-20180416-rev.pdf>>>> This draft addresses feedback and adds registrations of IPP attributes and a MIME media type.
>>>> _________________________________________________________
>> Michael Sweet, Senior Printing System Engineer
>>>> _______________________________________________
>> ipp mailing list
>>ipp at pwg.org>>https://www.pwg.org/mailman/listinfo/ipp>> _______________________________________________
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_________________________________________________________
Michael Sweet, Senior Printing System Engineer